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Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
V CC to GND ...........................................................-0.3V to +5.5V
LO1, LO2 to GND ...............................................................±0.3V
Any Other Pins to GND...............................-0.3V to (V CC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ..........................+15dBm
RFMAIN, RFDIV Current (RF is DC shorted to GND
through a balun)...............................................................50mA
Continuous Power Dissipation (Note 1) ...............................8.7W
θ JA (Notes 2, 3)..............................................................+38°C/W
θ JC (Notes 1, 3)...............................................................7.4°C/W
Operating Case Temperature Range
(Note 4) .............................................................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T J = T A + ( θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit optimized for the DCS/PCS band, V CC = +4.75V to +5.25V, T C = -40°C to +85°C. R1 = R4 = 806 Ω , R2 =
R5 = 2.32k Ω . Typical values are at V CC = +5.0V, T C = +25°C, unless otherwise noted. All parameters are production tested.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Supply Current
V CC
I CC
Total supply current, V CC = +5.0V
4.75
5
297
5.25
370
V
mA
LOSEL Input High Voltage
LOSEL Input Low Voltage
V IH
V IL
2
0.8
V
V
LOSEL Input Current
I IH and I IL
-10
+10
μA
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = +3.0V to +3.6V, T C = -40°C to +85°C, R1 = R4 = 909 Ω , R2 = R5 = 2.49k Ω . Typical values are at
V CC = +3.3V, T C = +25°C, unless otherwise noted. All parameters are guaranteed by design and not production tested.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
Total supply current, V CC = +3.3V
MIN
3.0
TYP
3.3
212
MAX
3.6
UNITS
V
mA
LOSEL Input High Voltage
LOSEL Input Low Voltage
V IH
V IL
2
0.8
V
V
2
_______________________________________________________________________________________
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